Engineering capability
| Manufacturing Capability 工程能力 | ||
| No. | Items | Capability |
| 1 | Layer 层数 | 1-20层 |
| 2 | Maximum panel Size 最大生产PNL长宽尺寸 | 558*670mm |
| 3 | Board thickness 板厚 | 0.20~3.20mm |
| 4 | Minimum line width/spacing 最小成品线宽/线距 | 0.065mm |
| 5 | Minimum line width tolerance 最小成品线宽公差 | +/-10% |
| 6 | Minimum finish hole size 最小成品孔径 | 0.10mm |
| 7 | Hole wall copper thickness 孔壁铜厚 | 35um Max |
| 8 | Maximum copper thickness in pattern 最大导线成品铜厚 | 210um |
| 9 | Hole size tolerance of PTH 金属化孔径公差 | 0.05mm |
| 10 | Hole size tolerance of NPTH 非金属化孔径公差 | 0.025mm |
| 11 | Aspect Ratio 板厚孔径比 | 10:1 |
| 12 | Hole Position Accuracy 孔与孔的位置公差 | ±0.05mm min |
| 13 | Outline Tolerance 外形尺寸公差 | ±0.05mm |
| 14 | Minimum Soldermask Dam 最小阻焊焊桥 | 0.065mm |
| 15 | Minimum Legend Printing Width 最小丝印字符线宽度 | 0.10mm |
| 16 | Insulation Resistance绝缘电阻 | 10000MΩ |
| 17 | Thermal Shock 热冲击 | 288℃*10s 3 times |
| 18 | Warpage and Bend 扭曲和弯曲 | 0.50% |
| 19 | Dielectric Strength 抗电强度 | 2000V |
| 20 | Peelable Strength 抗剥离强度 | Hoz:1.17kg/cm,1oz:1.4kg/cm,2oz:1.98kg/cm, |
| 21 | Soldemask Abrasion 阻焊剂硬度 | 6H pencil |
| 22 | Fire Resistance 阻燃性 | 94V-0 |
| 23 | Impedence Control 阻抗控制 | 8-10% |
| 24 | Alignment Tolerance For Multi-layer多层板层间对位公差 | 0.075mm |
| 25 | Minimum Space for Dielectric Layer Thickness最小介质层间距 | 0.05mm |
| 26 | Minimum Tolerance for Dielectric Layer Thickness介质层厚最小公差 | ±10% |
